Three dimensional stress vector sensor array and method...

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06912914

ABSTRACT:
A sensor array is configured based upon capacitive sensor techniques to measure stresses at various positions in a sheet simultaneously and allow a stress map to be obtained in near real-time. The device consists of single capacitive elements applied in a one or two dimensional array to measure the distribution of stresses across a mat surface in real-time as a function of position for manufacturing and test applications. In-plane and normal stresses in rolling bodies such as tires may thus be monitored.

REFERENCES:
patent: 3782486 (1974-01-01), Kuhn et al.
patent: 4177421 (1979-12-01), Thornburg
patent: 5499541 (1996-03-01), Hopf et al.
patent: 5571973 (1996-11-01), Taylot
patent: 5597984 (1997-01-01), Mohaupt
patent: 5678448 (1997-10-01), Fullen et al.
patent: 5760530 (1998-06-01), Kolesar
patent: 5775332 (1998-07-01), Goldman
patent: 6006386 (1999-12-01), Mohaupt
patent: 6216545 (2001-04-01), Taylor

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Three dimensional stress vector sensor array and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three dimensional stress vector sensor array and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three dimensional stress vector sensor array and method... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3414898

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.