Three-dimensional stacked substrate arrangements

Details Three-dimensional stacked substrate arrangements Three-dimensional stacked substrate arrangements

2011-07-05

2011-07-05

Lee, Calvin (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S613000

Reexamination Certificate

active

07973407

ABSTRACT:
Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.

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