Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-06-27
2006-06-27
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C438S106000
Reexamination Certificate
active
07067911
ABSTRACT:
A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first metal pillar. The second semiconductor chip assembly includes a second chip, a second conductive trace and a second encapsulant, and the second encapsulant includes a second aperture. The first metal pillar extends into the second aperture.
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Erickson, &#
Chiang Cheng-Lien
Lin Charles W. C.
Bridge Semiconductor Corporation
Hoang Quoc
Nelms David
Sigmond David M.
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