Three-dimensional stacked semiconductor package with chips...

Details Three-dimensional stacked semiconductor package with chips... Three-dimensional stacked semiconductor package with chips...

2007-06-05

2007-06-05

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23052, C257SE23039, C257SE23069, C257SE23068, C257SE23174, C257SE23178, C257S777000, C257S723000, C257S725000, C257S728000, C257S696000, C257S698000, C257S691000, C257S684000, C257S796000, C257S676000, C257S666000, C257S784000, C257S786000, C257S787000

Reexamination Certificate

active

11021313

ABSTRACT:
A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on opposite sides of the lead, and the wire bonds contact the same side of the lead.

REFERENCES:
patent: 4706166 (1987-11-01), Go
patent: 4807021 (1989-02-01), Okumura
patent: 4897708 (1990-01-01), Clements
patent: 4954875 (1990-09-01), Clements
patent: 4984358 (1991-01-01), Nelson
patent: 4996583 (1991-02-01), Hatada
patent: 5049979 (1991-09-01), Hashemi et al.
patent: 5104820 (1992-04-01), Go et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5299092 (1994-03-01), Yaguchi et al.
patent: 5332922 (1994-07-01), Oguchi et al.
patent: 5394303 (1995-02-01), Yamaji
patent: 5484959 (1996-01-01), Burns
patent: 5514907 (1996-05-01), Moshayedi
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5625221 (1997-04-01), Kim et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5689135 (1997-11-01), Ball
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5804874 (1998-09-01), An et al.
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5910685 (1999-06-01), Watanabe et al.
patent: 5973393 (1999-10-01), Chia et al.
patent: 6002167 (1999-12-01), Hatano et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6084309 (2000-07-01), Kawashima et al.
patent: 6087222 (2000-07-01), Jung Lin et al.
patent: 6087718 (2000-07-01), Cho
patent: 6124633 (2000-09-01), Vindasius et al.
patent: 6137163 (2000-10-01), Kim et al.
patent: 6165819 (2000-12-01), Seki et al.
patent: 6175149 (2001-01-01), Akram
patent: 6180881 (2001-01-01), Isaak
patent: 6188127 (2001-02-01), Senba et al.
patent: 6190944 (2001-02-01), Choi
patent: 6232213 (2001-05-01), King et al.
patent: 6235554 (2001-05-01), Akram et al.
patent: 6303997 (2001-10-01), Lee
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 6479321 (2002-11-01), Wang et al.
patent: 6483181 (2002-11-01), Chang et al.
patent: 6483718 (2002-11-01), Hashimoto
patent: 6492718 (2002-12-01), Ohmori
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6504241 (2003-01-01), Yanagida
patent: 6509639 (2003-01-01), Lin
patent: 6564454 (2003-05-01), Glenn et al.
patent: 6608371 (2003-08-01), Kurashima et al.
patent: 6744121 (2004-06-01), Chang et al.
patent: 6794741 (2004-09-01), Lin et al.
patent: 2002/0153599 (2002-10-01), Chang et al.
patent: 2003/0011052 (2003-01-01), Kim

Affiliated with

Also associated with

Rating

Three-dimensional stacked semiconductor package with chips... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional stacked semiconductor package with chips..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional stacked semiconductor package with chips... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3812858