Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-03-13
2007-03-13
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23039, C257SE23033, C257SE25023, C257SE23124, C257S777000, C257S723000, C257S778000, C257S734000, C257S737000, C257S738000, C257S698000, C257S692000, C257S693000, C257S779000, C257S696000, C257S673000, C257S775000, C257S776000, C257S784000, C257S786000, C257S680000
Reexamination Certificate
active
10695564
ABSTRACT:
A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first semiconductor chip and a first lead that is bent outside the first insulative housing. The second device includes a second insulative housing, a second semiconductor chip and a second lead that is flat outside the second insulative housing. The conductive bond contacts and electrically connects the leads.
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Bridge Semiconductor Corporation
Sigmond David M.
Williams Alexander Oscar
LandOfFree
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