Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-11-13
2008-10-21
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S077000, C439S067000
Reexamination Certificate
active
07438558
ABSTRACT:
A three-dimensional die configuration for mounting electronic components to a circuit board includes a circuit board having at least one circuit board die, a first electronic component mounted at the circuit board die and a first substrate member including a first surface electrically connected to the first chip. The three-dimensional die configuration further includes a double-sided land grid array having a first surface electrically connected to a second surface of the first substrate member. A second substrate member is electrically connected to a second surface of the double-sided land grid array. A second electronic component is electrically connected to a second surface of the second substrate member. A thermal interface member abuts the second chip and is covered by a cap member. The resulting three-dimensional die configuration establishes a multiple electronic component mounting arrangement having a footprint of a single electronic component.
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patent: 2003/0020151 (2003-01-01), Chen
Cantor & Colburn LLP
Chambers Travis
International Business Machines - Corporation
Ta Tho D.
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