Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1994-09-29
1998-08-11
Whitehead, Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257774, 437208, H01L 2348, H01L 2352, H01L 2118
Patent
active
057931151
ABSTRACT:
A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
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Dingle Brenda
Vu Duy-Phach
Zavracky Matthew
Zavracky Paul M.
Kopin Corporation
Whitehead Carl W.
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