Three-dimensional printed circuit board

Details Three-dimensional printed circuit board Three-dimensional printed circuit board

1989-07-24

1991-04-16

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29829, 29830, 174255, 264241, 264242, 361398, H05K 100

Patent

active

050084968

ABSTRACT:
A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions having a thickness less than the thickness of the rigid board sections. When a semi-crystalline or liquid-crystalline thermoplastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermoplastic molding material results in the connecting sections being bendable only under the influence of heat.

REFERENCES:
patent: 4066851 (1978-01-01), White et al.
patent: 4402135 (1983-09-01), Schweingruber et al.
patent: 4710419 (1987-12-01), Gregory
patent: 4772496 (1988-09-01), Maeda et al.

Affiliated with

Also associated with

Rating

Three-dimensional printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-422732