Three dimensional packaging arrangement for computer systems and

Details Three dimensional packaging arrangement for computer systems and Three dimensional packaging arrangement for computer systems and

1990-07-13

1991-11-12

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 80, 361392, 361396, 361401, 361406, 361412, H05K 720

Patent

active

050652770

ABSTRACT:
A three dimensional arrangement for packaging planar arrays of circuit components in a plurality of essentially planar layers in which the layers lie closely adjacent to one another is disclosed. Each layer is separated by a shell that interposes slots for allowing coolant to pass between the layers and electrical conductors through the shell, so that when the layers are placed together, the conductors form a bus through the structure.

REFERENCES:
patent: 4225900 (1980-09-01), Ciccio et al.
patent: 4539622 (1985-09-01), Akasaki
patent: 4694123 (1987-09-01), Massey

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