Three dimensional packaging and cooling of mixed signal,...

Details Three dimensional packaging and cooling of mixed signal,... Three dimensional packaging and cooling of mixed signal,...

2006-03-07

2006-03-07

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C174S015100, C257S714000

Reexamination Certificate

active

07009842

ABSTRACT:
An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.

REFERENCES:
patent: 3577024 (1971-05-01), Inagaki et al.
patent: 3659125 (1972-04-01), Basel
patent: 3733503 (1973-05-01), Potter
patent: 4198191 (1980-04-01), Pierce
patent: 4329603 (1982-05-01), Ballard
patent: 4611137 (1986-09-01), Sutrina
patent: 4692826 (1987-09-01), Raj et al.
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5251097 (1993-10-01), Simmons et al.
patent: 5314529 (1994-05-01), Tilton et al.
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5684352 (1997-11-01), Mita et al.
patent: 5713327 (1998-02-01), Tilton et al.
patent: 5718117 (1998-02-01), McDunn et al.
patent: 5719444 (1998-02-01), Tilton et al.
patent: 5731542 (1998-03-01), Limper-Brenner et al.
patent: 5831824 (1998-11-01), McDunn et al.
patent: 5860602 (1999-01-01), Tilton et al.
patent: 5880931 (1999-03-01), Tilton et al.
patent: 5933700 (1999-08-01), Tilton
patent: 6016969 (2000-01-01), Tilton et al.
patent: 6060966 (2000-05-01), Tennant et al.
patent: 6104610 (2000-08-01), Tilton et al.
patent: 6108201 (2000-08-01), Tilton et al.
patent: 6313992 (2001-11-01), Hildebrandt
patent: 6498725 (2002-12-01), Cole et al.
patent: 6552901 (2003-04-01), Hildebrandt
patent: 6625023 (2003-09-01), Morrow et al.
patent: 6710441 (2004-03-01), Eden et al.
patent: 6737301 (2004-05-01), Eden et al.
Advanced Thermal Management System for General Motors Power Inverter Module.
Ray, W.F., et al., “High Performance Switched Reluctance Brushless DC Drivers”, IEEE Transactions On Industry Applications, vol. 1A-22, p. 722, 1986.
Bose, B.K., et al., “Microcomputer Control of Switched Reluctance Motor”, IEEE Transactions On Industry Applications, vol. 1A-22, p. 708, 1986.
Moallem, M., et al., “Effect of Rotor Profiles on the Torque of a Switched Reluctance Motor”, IEEE Transactions On Industry, Applications, vol. 28, p. 364, 1992.
Harris, M.R., et al., “Review of the Integral-Horsepower Switched Reluctance Drive”, IEEE Transactions On Industry Applications, vol. 1A-22, p. 716, 1986.
Tilton, D.E., Charles, C.L., Pais, M.R., and Morgan, M.J., “High-Flux Spray Cooling in a Simulated Multichip Module”, HTD vol., 206-2, pp. 73-79, ASME National Heart Transfer Conf., Aug. 9-12, San Diego, CA, 1992.
Tilton, D.E., Chow, L.C., and Mahefkey, E.T., “High Power Density Evaporative Cooling”, AIAA-87-1536, 22nd AIAA Thermophysics, Conference, Honolulu, Hawaii, Jun. 1987.
Tilton, D.E., Ambrose, J.H., and Chow, L.C., “Closed-System, High-Flux Evaporative Spray Cooling”, SAE Paper 892316, Aerotech 89, Anaheim, CA.
Tilton, D.E., Spray Cooling, Ph.D. Dissertation, University of Kentucky, Dept. of Mechanical Engineering, 1989.
Tilton, D.E., Chow, L.C., Mahefkey, E.T., and Switzer, G., “Critical Heat Flux Phenomena in Spray Cooling”, AIAA Paper 90-1729, AIAA/ASME 5th Joint Thermophysics and Heat Transfer Conf., Seattle, WA, Jun. 18-20, 1990.

Affiliated with

Also associated with

Rating

Three dimensional packaging and cooling of mixed signal,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three dimensional packaging and cooling of mixed signal,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three dimensional packaging and cooling of mixed signal,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3592982