Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-03-03
2010-12-14
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S774000, C257S664000, C257SE21002, C257SE23010, C438S637000, C438S672000
Reexamination Certificate
active
07851918
ABSTRACT:
Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.
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International Preliminary Report on Patentability for International (PCT) Patent Application No. PCT/KR2006/000751, issued Jul. 1, 2008.
Background of the invention for the above captioned application (previously cited).
International Search Report prepared by the Korean Intellectual Property Office on Sep. 13, 2006 for PCT/KR2006/000751; Applicant, Wavenics Inc.
Cooper et al., “Multichip-on-Flex Plastic Encapsulated MHDI-Low Cost Substrateless Manufacturing for Microwave and Millimeterwave Modules,” IEEE MTT-S International Microwave Symposium Digest, Jun. 17-21, 1996, pp. 219-222.
Extended European Search Report for European Patent Application No. 06716201.6, dated Aug. 13, 2010.
Kim Kyoung Min
Kwon Young-Se
Le Dung A.
Sheridan & Ross P.C.
Wavenics Inc.
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