Three-dimensional nonwoven substrate having sub-millimeter...

Fabric (woven – knitted – or nonwoven textile or cloth – etc.) – Nonwoven fabric – Hydroentangled nonwoven fabric

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C442S327000, C442S381000, C442S387000, C442S409000, C428S131000, C428S170000, C428S171000, C428S172000

Reexamination Certificate

active

07144831

ABSTRACT:
The present invention is directed to a nonwoven fabric having a combination of a planar background element and projection elements to form a three-dimensional pattern, and a plurality of durable sub-millimeter orifices that extend at least partially through the depth of the three-dimensional pattern. The three-dimensional image of the non-apertured nonwoven fabric enhances the treatment, cleaning or cleansing performance due to pronounced surface projections that come in contact with the object to be treated or cleaned, and provide air passageways that are parallel to the plane of the substrate. Incorporation of sub-millimeter orifices in the nonwoven fabric, which extend through at least part of the nonwoven fabric, allow for transmission of fluids, as well as applied or embedded chemistries, from one side or surface of the substrate, or from a region internal to the nonwoven fabric, to the side which is in communication with the formed orifice.

REFERENCES:
patent: 2862251 (1958-12-01), Kalwaites
patent: 3485706 (1969-12-01), Evans
patent: 4588630 (1986-05-01), Shimalla
patent: 4614679 (1986-09-01), Farrington et al.
patent: 4741941 (1988-05-01), Englebert et al.
patent: 4925722 (1990-05-01), Jeffers
patent: 5026587 (1991-06-01), Austin et al.
patent: 5098764 (1992-03-01), Drelich et al.
patent: 5223319 (1993-06-01), Cotton et al.
patent: 5643653 (1997-07-01), Griesbach et al.
patent: 5830555 (1998-11-01), Srinivasan et al.
patent: 5932316 (1999-08-01), Cree et al.
patent: 6060149 (2000-05-01), Nissing et al.
patent: 6132841 (2000-10-01), Guthrie et al.
patent: RE38505 (2004-04-01), James et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Three-dimensional nonwoven substrate having sub-millimeter... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional nonwoven substrate having sub-millimeter..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional nonwoven substrate having sub-millimeter... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3719038

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.