Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating resistive material
Patent
1996-05-17
1998-04-14
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating resistive material
216 20, 216 35, 216 52, B44C 122, C23F 100
Patent
active
057387974
ABSTRACT:
A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut. The molded circuit structure is then removed from the mold and the metallic foil is further etched to complete the forming of the circuit.
REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4404059 (1983-09-01), Livshits et al.
patent: 4710419 (1987-12-01), Gregory
patent: 4944908 (1990-07-01), Leveque et al.
patent: 5220488 (1993-06-01), Denes
Belke, Jr. Robert E.
Glovatsky Andrew Z.
Todd Michael G.
Zitzmann Alice D.
Ford Global Technologies Inc.
Malleck Joseph W.
Powell William
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