Electricity: electrical systems and devices – Miscellaneous
Patent
1992-03-02
1993-06-22
Thompson, Gregory D.
Electricity: electrical systems and devices
Miscellaneous
29840, 29739, 2281802, 228387, 361393, 361396, 361406, 361412, 257723, 257701, 257712, H05K 114
Patent
active
052220141
ABSTRACT:
A stackable three-dimensional multi-chip module (MCM) is provided whereby each level of chip carrier is interconnected to another level of chip carrier through reflowing of solder balls pre-bumped onto each carrier. Each level of chip carrier, except for the top carrier, has solder balls on both top and bottom surfaces of the substrate. Optional lids can be used to seal each device, and the lid height would serve as a natural positive stand-off between each level of carriers, giving rise to hour glass shaped solder joints which maximizes the fatigue life of the joints. Heat sinks to further enhance heat dissipation of the MCM can be easily accommodated in this stacking approach. Furthermore, each substrate is capable of carrying multiple chips, so the module incorporates planar chip density growth concurrently with the three-dimensional growth giving rise to an ultradense MCM.
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"Stacked High-Density Multichip Module," by R. A. Jarvela et al., IBM Technical Disclosure Bulletin, vol. 14, No. 10, Mar. 1972, pp. 2896-2897.
"3-D Interconnection for Ultra-Dense Multichip Modules," by Christian Val et al., IEEE Transactions on Components, Hybrids, and Manuf. Tech., vol. 13, No. 4, Dec. 1990, pp. 814-821.
"DIP Storage Module with Stacked Chips," by J. W. Schmieg, IBM Technical Disclosure Bulletin, vol. 23, No. 6, Nov. 1980, p. 2337.
Clingan Jr. James L.
Motorola Inc.
Thompson Gregory D.
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