Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1998-10-01
2001-03-27
Donovan, Lincoln (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S066000, C439S074000, C361S726000, C257S704000
Reexamination Certificate
active
06206705
ABSTRACT:
BACKGROUND
Electronic components are often subjected to harsh environments. For instance, space-employed electronics require components that are rugged, lightweight, and built to withstand high G-forces. Such devices often need to withstand the unpredictable forces involved in liftoff and landing.
Different electronics packaging types are known. One system which has been recently used is the so-called multi-chip module system. The multi-chip module systems are a package with a number of electronic circuitry thereon, in a specified package protocol. All four perimeter edges of the multi-chip module define edge connectors. The multi-chip modules come in many flavors, including a CPU module, Gateway module, DRAM, SRAM, Flash, I/O, and Power modules.
Other such existing electronics packaging systems are also known that do and do not have electrical connections around their entire perimeter.
SUMMARY
The present disclosure describes a packaging system for an electronics system. According to this system, a three-dimensional connection is made by using hollow-center interconnect rings making connections between stacked electronic devices. The interconnect rings are preferably formed from elastomeric connectors with a plurality of conductors on a KAPTON™ device, and retained in place by a connector retainer/spacer. The connector holds the the electronic devices spaced from one another, in electrical communication and with an effective amount of room for electrical components.
The perimeter connectors can define different buses, throughout the device or locally.
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Dr. Paul L. Borril, Advances in Bus Architecture and Theory, IEEE COMPCON Spring 1995 Conference, Tutorial #4, FSCEM: Mechanical and FSCEM: Stacking Modules, May 1992.
Bolotin Gary S.
Cardone John
California Institute of Technology
Donovan Lincoln
Fish & Richardson P.C.
Webb Brian S.
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