Three-dimensional modular assembly of integrated circuits

Details Three-dimensional modular assembly of integrated circuits Three-dimensional modular assembly of integrated circuits

1995-02-21

1996-02-13

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361735, 361790, 361749, 257686, 257778, 257787, H05K 702

Patent

active

054916127

ABSTRACT:
An integrated circuit package that includes three base substrate support members. One base substrate support member is rigid and has two sides and the other two base substrate members are flexible and are located adjacent each side of the rigid base substrate support member. Each flexible base substrate support member has an inner surface and a series of flip chips are located between the inner surfaces of the flexible base substrate support members and the sides of the rigid base substrate support member. The three base substrate support members are electrically connected together and a termination connection is provided at one end of the assembly. In addition, logic chips are provided that are located adjacent the connector for controlling the various flip chips.

REFERENCES:
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5327325 (1994-07-01), Nicewarner, Jr.

Affiliated with

Also associated with

Rating

Three-dimensional modular assembly of integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional modular assembly of integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional modular assembly of integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-244222