Three-dimensional microwave circuit carrier and integral wavegui

Wave transmission lines and networks – Coupling networks – Balanced to unbalanced circuits

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333 33, 333238, 333247, H01P 5107

Patent

active

050458205

ABSTRACT:
A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.

REFERENCES:
patent: 3634789 (1972-01-01), Stuckert
patent: 4260964 (1981-04-01), Saul
patent: 4550296 (1985-10-01), Ehrlinger et al.
patent: 4679249 (1987-07-01), Tanaka et al.
patent: 4742571 (1988-05-01), Letron

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