Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2005-12-21
2010-02-09
Nguyen, Nam X (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S118000, C205S183000
Reexamination Certificate
active
07658831
ABSTRACT:
Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
REFERENCES:
patent: 6027630 (2000-02-01), Cohen
patent: 6050829 (2000-04-01), Eldridge et al.
patent: 6937042 (2005-08-01), Yoshida et al.
patent: 2002/0105080 (2002-08-01), Speakman
patent: 2003/0083771 (2003-05-01), Schmidt
patent: 2005/0023148 (2005-02-01), Lockard et al.
patent: 2005/0032362 (2005-02-01), Cohen
patent: 2005/0032375 (2005-02-01), Lockard et al.
patent: 2005/0045484 (2005-03-01), Smalley et al.
patent: 2007/0265795 (2007-11-01), Mathieu
patent: 2008/0088010 (2008-04-01), Hobbs et al.
Nozawa, “Epson Prints 20-Layer Board with Inkjet Technology” Feb. 2005, Nikkei Electronics Asia, Nikkei Business Publications, Inc., submitted pages printed from http://www.techhon.nikkeibp.co.jp.
“Welcome to the ink-jet age” ZDNet.co.uk of CNET Networks, 5 pages, submitted pages printed from http:/
ews.zdnet.co.uk.
“Epson Inkjet Technology Used to Fabricate World's First Ultra-Thin Multilayer Circuit Board”, News Release, Nov. 1, 2004, 2 pages, submitted pages printed from http://www.epson.co.jp.
Butterfield, “The Print Shop: Sci-Fi Inkjet Printers” on-line article, Mar. 1, 2005, 2 pages, submitted pages printed from http://www.pcworld.com.
Wohlers, “A Year Filled With Promising R&D,” Time-Compression Technologies Magazine, 4 pages, Nov./Dec. 2002, Wohlers Associates.
Lipson, “Homeade,” IEEE Spectrum, pp. 24-31, May 2005.
Canny et al., “Flexonics,” Electrical Engineering and Computer Sciences, University of California, Berkeley, pp. 1-17, Dec. 14-17, 2002.
Graham-Rowe, “‘Gadget printer’ promises industrial revolution,” New Scientist, 2 pages, Jan. 2003.
Gay, “Direct Writing Global status and opportunities for the UK in advanced manufacturing,” Crown, Feb. 2004, pp. i-vii and 1-1 through 6-1.
“ProMetal 3-D Printing Process,” ProMetal division of The Ex One Company (Irwin, Pennsylvania), 2 pages, date of first publication unknown, submitted pages printed from http://www.prometal.com/process.html on Apr. 20, 2006.
“ProMetal Equipment,” ProMetal division of The Ex One Company (Irwin, Pennsylvania), 2 pages, date of first publication unknown, submitted pages printed from http://www.prometal.com/equipment.html on Apr. 20, 2006.
Fang Treliant
Hobbs Eric D.
Mathieu Gaetan L.
Burraston N. Kenneth
FormFactor, Inc
Nguyen Nam X
Van Luan V
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