Three-dimensional microprobe array

Details Three-dimensional microprobe array Three-dimensional microprobe array

2011-05-24

2011-05-24

Noland, Thomas P (Department: 2856)

Geometrical instruments

Gauge

Having a movable contact probe

C033S560000, C073S866500, C324S754070

Reexamination Certificate

active

07946050

ABSTRACT:
The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.

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