Three dimensional microelectric packaging

Details Three dimensional microelectric packaging Three dimensional microelectric packaging

1989-11-22

1991-04-09

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 75, 361381, 361382, 361385, H01L 2316, H01L 2344, H05K 714

Patent

active

050069250

ABSTRACT:
A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said plurality substrates are physically joined to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and further wherein at least one cooling channel is provided within said enclosure into which a cooling fluid may be introduced.

REFERENCES:
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4571663 (1986-02-01), McPherson
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 4694378 (1987-09-01), Nakayama et al.
patent: 4763298 (1988-08-01), Hoelzel et al.
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4868712 (1989-09-01), Woodman
patent: 4880053 (1989-11-01), Sheyman
patent: 4891688 (1990-01-01), Longerich
patent: 4893174 (1990-01-01), Yamada
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 4922378 (1990-05-01), Malhi et al.

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