Three-dimensional memory system-on-a-chip

Details Three-dimensional memory system-on-a-chip Three-dimensional memory system-on-a-chip

2007-01-02

2007-01-02

Pert, Evan (Department: 2826)

Optics: measuring and testing

Infrared and ultraviolet

C365S063000, C257S211000

Reexamination Certificate

active

10967893

ABSTRACT:
The present invention provides a three-dimensional memory (3D-M) system-on-a-chip (SoC). It takes full advantage of the difference in the number of interconnect levels between the embedded processor (eP) and embedded memory (eM) in an SoC chip. The un-used interconnect space on top of the eM block is converted into 3D-M. This conversion incurs minimum additional cost, but with significant benefits: 3D-M can add a large storage capacity to the SoC chip and therefore the chip becomes more powerful.

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patent: 6864585 (2005-03-01), Enquist
patent: 6948105 (2005-09-01), Rajsuman
patent: 2006/0097279 (2006-05-01), Zhang

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