Three-dimensional memory module architectures

Details Three-dimensional memory module architectures Three-dimensional memory module architectures

2007-10-23

2011-11-15

Nguyen, Tuan (Department: 2824)

Static information storage and retrieval

Interconnection arrangements

Optical

C365S230030, C365S051000

Reexamination Certificate

active

08059443

ABSTRACT:
Various embodiments of the present invention are directed to stacked memory modules. In one embodiment of the present invention, a memory module comprises at least one memory-controller layer stacked with at least one memory layer. Fine pitched through vias (e.g., through silicon vias) extend approximately perpendicular to a surface of the at least one memory controller through the stack providing electronic communication between the at least one memory controller and the at least one memory layers. Additionally, the memory-controller layer includes at least one external interface configured to transmit data to and from the memory module. Furthermore, the memory module can include an optical layer. The optical layer can be included in the stack and has a bus waveguide to transmit data to and from the at least one memory controller. The external interface can be an optical external interface which interfaces with the optical layer.

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