Three dimensional memory in a system on a chip

Details Three dimensional memory in a system on a chip Three dimensional memory in a system on a chip

2008-09-12

2011-10-18

Doan, Nghia (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Integrated circuit design processing

Physical design processing

C716S100000, C716S101000, C716S102000, C716S103000, C716S104000, C716S105000, C716S117000, C716S118000, C716S119000, C716S138000, C365S129000, C365S130000, C365S131000

Reexamination Certificate

active

08042082

ABSTRACT:
The invention relates to multi-planar memory components in a three-dimensional integrated circuit system configuration. A multi-planar memory system consisting of a plurality of memory circuit planes in a three-dimensional system on a chip (3D SoC) comprised of a plurality of memory layers, at least one logic circuit layer and an interface configured to provide access to memory and logic circuit layers.

REFERENCES:
patent: 5502667 (1996-03-01), Bertin et al.
patent: 6515888 (2003-02-01), Johnson et al.
patent: 7193239 (2007-03-01), Leedy
patent: 7402897 (2008-07-01), Leedy
patent: 7633789 (2009-12-01), Norman
patent: 7692448 (2010-04-01), Solomon

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