Multiplex communications – Pathfinding or routing – Through a circuit switch
Reexamination Certificate
1999-10-26
2003-01-07
Yao, Kwang Bin (Department: 2664)
Multiplex communications
Pathfinding or routing
Through a circuit switch
C340S870030
Reexamination Certificate
active
06504841
ABSTRACT:
The first related patent application for IMPLEMENTATION OF MULTI-STAGE SWITCHING NETWORKS generally concerns the design of multi-stage interconnection switching networks that provide for the exchange of data between multiple electronic devices, and more particularly concerns the logic organization and layout of semiconductor die, and the associated wiring between such die, for implementing large and very large three-dimensional multi-stage interconnection networks. The multi-stage interconnection networks so designed are characterized by (i) an efficient logical organization, (ii) a very large size that typically interconnects of the order of 4096 and more communication ports, and (iii) a sophisticated, three-dimensional, interconnection geometry.
The present application concerns the rule-directed design of three-dimensional multi-stage interconnection networks based on (i) electrical interconnection proceeding through multiple parallel wires, normally in the form of flexible ribbon cable, extending in a flat plane between (ii) multiple planes, or modules, that are preferably orthogonal to the planar interconnecting wires in which modules reside multiple standard switching chips that also constitute portions of the interconnection paths. The present application is thus related to the predecessor application as a particular methodology for realizing a three-dimensional electrical interconnection—particularly between large numbers of points at high densities as epitomizes a very large multi-stage switching, or interconnection, network. Multi-stage interconnection, or switching, networks of the present invention will be characterized by the orderly, rule-directed, co-location of a greater density of interconnection wires—normally in the form of flexible ribbon cable—laid flat and parallel, or, in regions, orthogonal, within small volumes between each of successive planes, or modules, within which reside standard interconnection routing chips, or dice. The physical geometry of such a multi-stage interconnection, or switching, network will appear dense, and complex, but regular and ordered.
The second related patent application for PAD AND CLIP GEOMETRIES FOR MOUNTING AND ELECTRICALLY CONNECTING RIBBON CABLES TO SWITCHING CHIPS IN SPACED-PARALLEL PLANAR MODULES concerns a preferred physical geometry for each of (i) a spring connector for securing flat circuit, typically flexible ribbon cable, ends in pressured contact with a substrate (of a plane, or module), in which is present (ii) a pattern of electrical pads. The electrical and mechanical connection taught within the second related patient application is characterized in that (i) flat circuits, normally in the form of flexible ribbon cables, are routed through free space substantially in each of two orthogonal planes while (ii) the points of connection to the bent ends of all such flat circuits (e.g., ribbon cables) are arrayed along diagonals in yet another, further orthogonal, plane of connection that is established by arrayed chips held in a planar module, or tile. In simple terms, the 90° bent wire ends of one flat circuit (ribbon cable) will be connected in the orthogonal plane of a module simultaneously that the 90° bent wire ends of another flat circuit (another ribbon cable)—located in another, orthogonal, plane—are connected in the plane of the same module. Although this can clearly be done when spacing is adequate, in actual implementation the flat circuits (ribbon cables) and modules will be seen to be tightly packed. This second related patent application is thus related to the present application as a preferred means for realizing a compact electrical connector/electrical connection in a three-dimensional multi-stage interconnection, or switching, network.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally concerns the design of three-dimensional multi-stage interconnection networks based on (i) many flat circuits, normally in the form of flexible ribbon cables, connecting between each of (ii) multiple planes, or modules, or tiles in which reside both standard chips and printed wiring that also constitute portions of the interconnection paths.
The present invention particularly concerns very large scale interconnection, or switching, networks that are not only logically efficient, and potentially also non-blocking, but that are, in accordance with the present invention, physically realized in structures that are each of economic, manufacturable, orderly, and maintainable because they are constructed in accordance with a rule-directed physical (inter)connection geometry. The rule-directed interconnection geometry is efficient, reliable, regular, and, arguably, elegant.
2. Description of the Prior Art
The present invention is concerned with the physical realization of multi-stage interconnection switching networks which provide for the efficient and rapid communication of data between large numbers of electronic devices, typically hundreds and even thousands of computer data processors. The multi-stage interconnection switching networks involve large numbers of semiconductor switch dice located in co-parallel planar modules which comprise the stages, and (ii) the associated electrical interconnection wiring between the planar-arrayed dice in each stage, forming thus a switching network in three dimensions.
The switching networks of the present invention are designed with switches, or switchpoints, that are located in logical rows and in logical columns, as is common. Such switching networks are commonly physically constructed with the physical switches—which are commonly implemented from semiconductor dice—arranged into physical ranks and physical files. When large numbers of electronic devices must be interconnected by even larger numbers of switches, the switches are commonly logically and physically arrayed as multiple stages. Because laying out each of the stages on the same plane soon becomes unwieldy large, each stage is laid out on a single plane, and the planes are stacked one atop another in three dimensions.
If, for smaller switching networks, all the switches, or switchpoints, are physically located in a common plane—such as on a single circuit panel or on a number of circuit panels adjacent to one another, then the interconnection wiring between the outputs and the inputs of the various switches of this circuit panel are clearly accomplished in, or substantially in, the plane of the circuit panel. When several circuit panels are used, it is common to connect from one to the next by edge connectors. The several printed circuit panels may be located in a single plane, and the edge connections may thus also be in this plane. However, if the edge connections are made with flexible cable, including the multi-conductor flexible cable commonly known as ribbon cable, as is common, then the panels may be arrayed spaced parallel to each other in a stack.
Although wiring has occasionally been made from central area regions of one panel directly across to corresponding central area regions of an adjacent parallel panel, at least two problems have beset making electrical connection directly from panel to panel in the volume between them so as to attempt to realize high density, and minimal communication delay, within a multi-stage switching network. If the interconnecting wires are permanently, or semi-permanently, affixed to the panels, such as by soldering in holes, then the successive panels must be “laid up” in order during construction, and become effectively impossible to disassemble for maintenance to replace any chip switches that have failed. If the interconnecting wires—commonly in the form of ribbon cables with stripped wire ends—are instead not to be placed through holes in the panels and soldered, then a reliable form of electrical connection, and electrical connector, is needed between the interconnecting wires and the transverse panels. Moreover, even if a suitable connector is found, the typically high wiring density between the panels tends to turn the volume betwee
Kryzak Charles
Larson Brian Ralph
Fuess & Davidenas
Jones Prenell
Lockheed Martin Corporation
Yao Kwang Bin
LandOfFree
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