Three dimensional interconnected integrated circuit

Details Three dimensional interconnected integrated circuit Three dimensional interconnected integrated circuit

1986-12-01

1989-01-31

Macon, Robert S.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 55, 357 75, 361392, H01L 2702

Patent

active

048019925

ABSTRACT:
A three dimensional interconnected modular integrated circuit and method of manufacturing same are provided wherein the modular circuit comprises individual planar integrated circuits which are connected together and to an interconnect chip for mounting on a lead line package resulting in an increase in available integrated circuit surface area for a given footprint area.

REFERENCES:
patent: 3880493 (1975-04-01), Lockhart, Jr.
patent: 4295924 (1981-10-01), Garnache et al.

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