Three-dimensional interconnect having modules with vertical top

Details Three-dimensional interconnect having modules with vertical top Three-dimensional interconnect having modules with vertical top

1994-10-14

1997-11-25

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361729, 361730, 361733, 439 44, H05K 710, H05K 500, H01R 2900

Patent

active

056918852

ABSTRACT:
Circuit supporting modules form a three-dimensional communication interconnect mesh. A first embodiment three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure. In a second embodiment the interconnect is hexahedral. A characteristic of both is embodiments is that, although connections are made to plural other modules, the physical connections are made along the same direction.

REFERENCES:
patent: 4423465 (1983-12-01), Teng-Chin et al.
patent: 4499607 (1985-02-01), Higgins
patent: 4582953 (1986-04-01), Nagase et al.
patent: 4727410 (1988-02-01), Higgins, III
patent: 4733461 (1988-03-01), Nakano
patent: 4742552 (1988-05-01), Andrews
patent: 4954458 (1990-09-01), Reid
patent: 4969827 (1990-11-01), Hahs, Jr.
patent: 4983533 (1991-01-01), Go
patent: 5006920 (1991-04-01), Schafer et al.
patent: 5016138 (1991-05-01), Woodman
patent: 5051865 (1991-09-01), Kato
patent: 5568361 (1996-10-01), Ward et al.
Shin, "Harts: A Distributed Real Time Architecture," IEEE, pp. 25-35 (May 1991).
Chen, et al., "Addressing, Routing and Broadcasting in Hexagonal Mesh Multiprocessors," IEEE Trans. on Computers, 39(1):10-18 (1990).
M.J. Little, et al., "The 3-D Computer," Journal of VLSI Signal Processing, 2 (2) (Oct., 1990).
Gaensslen, "Multichip Packaging," IBM Disclosure Bulletin, 12(10):1579-1580 (Mar., 1970).

Affiliated with

Also associated with

Rating

Three-dimensional interconnect having modules with vertical top does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensional interconnect having modules with vertical top , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional interconnect having modules with vertical top will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2112217