Three-dimensional integrated circuit structure

Details Three-dimensional integrated circuit structure Three-dimensional integrated circuit structure

2011-02-15

2011-02-15

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S046000, C257S544000

Reexamination Certificate

active

07888764

ABSTRACT:
A semiconductor structure includes an interconnect region and a semiconductor stack bonded to the interconnect region through a bonding region. The stack includes at least two semiconductor layers having different electrical properties. The stack also includes single crystalline semiconductor material. The stack can be processed to form a mesa structure and the mesa structure can be processed to from a vertically oriented semiconductor device.

REFERENCES:
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patent: 5563084 (1996-10-01), Ramm et al.
patent: 6849891 (2005-02-01), Hsu et al.
patent: 6943067 (2005-09-01), Greenlaw
patent: 2004/0012016 (2004-01-01), Underwood et al.
patent: 2007/0145514 (2007-06-01), Kocon
patent: 2008/0017906 (2008-01-01), Pelella et al.

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