Three dimensional integrated circuit package

Details Three dimensional integrated circuit package Three dimensional integrated circuit package

1989-09-18

1991-05-14

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174252, 357 80, 361385, 361396, H05K 720

Patent

active

050161385

ABSTRACT:
This invention discloses a three-dimensional, high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together. Techniques for interconnecting the layers to one another and for connecting the layers to external circuitry are also disclosed. Techniques for cooling the stack with heat sinks or fluid flow are also disclosed.

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patent: 4628411 (1986-12-01), Balderes
patent: 4727410 (1988-02-01), Higgins, III
patent: 4868712 (1989-09-01), Woodman

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