Three-dimensional electronic circuit of interconnected modules

Details Three-dimensional electronic circuit of interconnected modules Three-dimensional electronic circuit of interconnected modules

1994-07-25

1996-10-22

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361729, 361784, 361785, 361790, 361803, 439 74, H05K 700, H05K 702, H01R 2368, H01R 2372

Patent

active

055683614

ABSTRACT:
Circuit supporting modules form a three-dimensional communication interconnect mesh. Each module has fewer than six sets of connectors, preferably four. The preferred three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure.

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