Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-08-16
1994-11-15
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 74, H01R 909
Patent
active
053642775
ABSTRACT:
A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a Teflon pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.
REFERENCES:
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4403272 (1983-09-01), Larson et al.
patent: 4891014 (1990-01-01), Simpson et al.
patent: 4911643 (1990-03-01), Perry et al.
patent: 5147208 (1992-09-01), Bachler
Crumly William R.
Feigenbaum Haim
Schreiber Christopher M.
Denson-Low W. K.
Gudmestad T.
Hughes Aircraft Company
Leitereg Elizabeth E.
Nguyen Khiem
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