Three-dimensional electrical interconnection system

Details Three-dimensional electrical interconnection system Three-dimensional electrical interconnection system

1997-09-22

2000-08-29

Nguyen, Khiem

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Within distinct housing spaced from panel circuit arrangement

439931, H01R 909

Patent

active

061099325

ABSTRACT:
A molded electrical interconnection system includes a three-dimensional molded dielectric substrate including at least one open socket. Stamped and formed electrical circuitry is embedded in the molded substrate and includes a contact blade projecting into the socket. An interface module is positioned in the socket to define a receptacle for receiving a male terminal of a complementary connecting device.

REFERENCES:
patent: 4603930 (1986-08-01), Ito
patent: 4632492 (1986-12-01), Yamada
patent: 4738631 (1988-04-01), Takahashi et al.
patent: 4895536 (1990-01-01), Gingerich et al.
patent: 4978307 (1990-12-01), Billman et al.
patent: 5057026 (1991-10-01), Sawai et al.
patent: 5320558 (1994-06-01), von Roretz
patent: 5382169 (1995-01-01), Bailey et al.
patent: 5509812 (1996-04-01), Comerci et al.
patent: 5599201 (1997-02-01), Sommer et al.
patent: 5622507 (1997-04-01), Kasai

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