Three dimensional die packaging in multi-chip modules

Details Three dimensional die packaging in multi-chip modules Three dimensional die packaging in multi-chip modules

1994-12-19

1996-02-27

Sparks, Donald A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174255, 361761, 361783, 361784, 361790, 361792, 361795, 361803, 439 66, 439 91, H05K 114, H05K 118, H05K 111, H01R 458

Patent

active

054953944

ABSTRACT:
A multi-chip module wherein electrical components, such as integrated circuit devices, are packaged in a three dimensional arrangement. The multi-chip module includes a first, or upper, substrate including a signal layer formed on the top surface of the substrate and at least one integrated circuit device mounted to the top surface of the substrate and electrically connected to the signal layer. The module further includes a second, or internal, substrate, also including a first signal layer formed on the top surface of the substrate and at least one integrated circuit device mounted to the top surface of the substrate and electrically connected with the signal layer formed on the top surface of the second substrate. The second substrate includes a cavity through the substrate corresponding to each integrated circuit device mounted thereto. Each integrated circuit device mounted to the second substrate is placed within its corresponding cavity so that its top and bottom surfaces are flush with the top and bottom surfaces of the second substrate. Electrical signal paths are provided through the first substrate to electrically connect the integrated circuit devices mounted to the first and second substrates, and through the first and second substrates to electrically connect the multi-chip module components and circuitry to a printed circuit board to which the module is mounted. The multi-chip module may include two, three, or more signal layers and substrates connected as described herein.

REFERENCES:
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5290971 (1994-03-01), Hamaguchi et al.
patent: 5371654 (1994-12-01), Beaman et al.

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