Three-dimensional component stacking using high density multichi

Details Three-dimensional component stacking using high density multichi Three-dimensional component stacking using high density multichi

1997-09-29

1999-05-18

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361777, 361783, 361789, 361803, H05K5/02

Patent

active

059056398

ABSTRACT:
A three-dimensional circuit structure that interconnects an integrated circuit chip, along with additional active devices and passive components to a substrate by way of a high density multichip interconnect decal disposed on the integrated circuit chip. The three-dimensional circuit structure thus comprises the substrate, an integrated circuit attached to the top of the substrate, and the high density multichip interconnect decal attached to the integrated circuit. One or more passive components and relatively small active devices are attached to the top of the high density multichip interconnect decal. A plurality of three-bond, daisy-chained wedge bonds are used to interconnect the active devices and passive components to the substrate by way of the HDMI decal. Each wedge bond comprises a wire that initiates at an HDMI decal bond pad, an intermediate stitch bond at an integrated circuit bond pad, and terminates at a substrate bond pad.

REFERENCES:
patent: 5200810 (1993-04-01), Wojnarowski et al.
patent: 5473514 (1995-12-01), Nagano
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5581498 (1996-12-01), Ludwig et al.

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