Three-dimensional compact array of electronic circuitry

Details Three-dimensional compact array of electronic circuitry Three-dimensional compact array of electronic circuitry

1995-03-10

1996-08-13

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257724, 361716, 361735, A05K 720

Patent

active

055462740

ABSTRACT:
A three-dimensional compact array of electronic circuitry includes a plurality of stacked modular compact arrays of electronic circuitry. Each modular compact array of electronic circuitry includes a substrate-less multi-chip module supporting a number of integrated circuits and interconnect which electrically connects the integrated circuits. Each modular compact array of electronic circuitry further includes an integrated heat exchanger and stacking connector supporting the substrate-less multi-chip module. The integrated heat exchanger and stacking connector includes a transverse connector region including a plurality of connector vias for connection to the interconnect of the substrate-less multi-chip module, and a transverse flow region including channels for circulating a coolant to remove heat from the substrate-less multi-chip module.

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patent: 5241450 (1993-08-01), Bernhardt
Narayan, et al, "Thin Film Transfer Process for Low Cost MCM-D Fabrication", Proceeding of the 1994 International Conference on Multichip Modules, pp. 105-111, Apr. 13-15, 1994, Denver, Colorado.

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