Three dimensional assembly of integrated circuit chips

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361760, 361785, 361792, 361813, 174 521, 174255, 439 68, 257686, 257697, H05K 111

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active

053273273

ABSTRACT:
The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.

REFERENCES:
patent: 4525921 (1985-07-01), Carson et al.
patent: 4617160 (1986-10-01), Belanger et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4704319 (1987-11-01), Belanger et al.
patent: 4706166 (1987-11-01), Go et al.
patent: 4764846 (1988-08-01), Go et al.
patent: 4983533 (1991-01-01), Go et al.
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5104820 (1992-04-01), Go et al.
Texas Instrument Inc., Frew, High Density Memory Packaging, Jul. 1990, SPIE.
Dean L. Frew et al.-Tri-TMS320C30 Multichip Module: Signal Processor Package Design-Gomac '90 (Nov.).
Dean L. Frew-High Density Memory Packaging Technology High Speed Imaging Applications-SPIE Jul. 1990.
Robert Bruns et al.-Utilizing Three-Dimensional Memory Packaging and Silicon-On-Silicon Technology for Next Generation Recording Devices.

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