Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-10-30
1994-07-05
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361785, 361792, 361813, 174 521, 174255, 439 68, 257686, 257697, H05K 111
Patent
active
053273273
ABSTRACT:
The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.
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Drumm James
Elder Rick
Frew Dean L.
Hecker, Jr. Philip E.
Johnson Randall E.
Donaldson Richard L.
Hiller William E.
Honeycutt Gary C.
Picard Leo P.
Texas Instruments Incorporated
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