Thioether sulfonates for use in electroplating baths

Details Thioether sulfonates for use in electroplating baths Thioether sulfonates for use in electroplating baths

1975-03-07

1976-10-12

Brust, Joseph Paul

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C-metal

204 40, 2604658R, 260513N, C07C12116, C07C12120, C07C14313

Patent

active

039857840

ABSTRACT:
A composite nickel-containing electroplate is formed on a base metal surface by electroplating on the surface an adherent nickel or nickel alloy layer having a thickness of from about 0.15 to 1.5 mils and an average sulfur content of less than about 0.03%. An intermediate nickel or nickel alloy layer, having a thickness of from about 0.005 to 0.2 mils and an average sulfur content of from about 0.05 to 0.3% is then electroplated on the lower layer. An adherent upper nickel or nickel alloy having a thickness of from about 0.2 to 1.5 mils and average sulfur content of from about 0.02 to 0.15% is then electroplated on the intermediate layer, the upper layer containing a lower percentage of sulfur then the lower layer. The source of sulfur, for at least the intermediate layer, is provided by including novel thioethersulfonates of nitriles or amides in the plating bath for that layer.

REFERENCES:
patent: 2330713 (1943-09-01), Holbrook et al.
patent: 2462406 (1949-02-01), Langkammerer
patent: 2694718 (1954-11-01), Salminen et al.
patent: 3112198 (1963-11-01), Klinger
patent: 3344174 (1967-09-01), Broussalian
patent: 3502708 (1970-03-01), Thoma et al.
patent: 3707507 (1972-12-01), Williams
patent: 3734840 (1973-05-01), Passal

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