Thinning of imaging device processed wafers

Details Thinning of imaging device processed wafers Thinning of imaging device processed wafers

1992-03-19

1993-08-10

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 3, 437 53, 437225, 437974, 437231, 148DIG12, H01L 21302

Patent

active

052348601

ABSTRACT:
A process for supporting an image sensor wafer includes providing a support oxide layer on one surface of a support wafer and an etch resistant layer on the opposite surface. The support oxide layer is bonded to the image sensor oxide layer.

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