Thinned, strengthened semiconductor substrates and packages...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S753000, C438S459000, C438S460000, C438S690000, C438S691000, C216S011000, C216S048000

Reexamination Certificate

active

06940181

ABSTRACT:
A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over, a back side of the wafer while in a rough state from backgrinding without prior, conventional polishing or plasma etching of the back side. The thin layer or film of reinforcement material fills grooves, fractures and scratches in the back side of the wafer, enhance the rigidity of the wafer and provide a planar, smooth, back side surface layer. The reinforcement material counteracts internal stresses of the wafer tending to warp, crack and propagate lattice defects in the wafer. The reinforcement material may also be configured to act as a die attach adhesive, may provide an ionic barrier, and may remain as part of the packaging for semiconductor dice singulated from the wafer.

REFERENCES:
patent: 5164815 (1992-11-01), Lim
patent: 5313102 (1994-05-01), Lim et al.
patent: 5476566 (1995-12-01), Cavasin
patent: 5583372 (1996-12-01), King et al.
patent: 6027659 (2000-02-01), Billett
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6235387 (2001-05-01), Bennett et al.
patent: 6245677 (2001-06-01), Haq
patent: 6258198 (2001-07-01), Saito et al.
patent: 6279976 (2001-08-01), Ball
patent: 6403449 (2002-06-01), Ball
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6534419 (2003-03-01), Ong
patent: 2003/0096507 (2003-05-01), Baker et al.
patent: 2004/0110010 (2004-06-01), Buchwalter et al.
patent: 359104523 (1984-06-01), None
Wolf et al., “Silicon Processing for the VLSI Era,” vol. 1: Process Technology, Lattice Press, 1986, pp. 238-239.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thinned, strengthened semiconductor substrates and packages... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thinned, strengthened semiconductor substrates and packages..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thinned, strengthened semiconductor substrates and packages... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3405015

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.