Thin wall frame construction for electronic devices

Details Thin wall frame construction for electronic devices Thin wall frame construction for electronic devices

1996-09-06

1998-02-24

Nguyen, Matthew V.

Electricity: circuit makers and breakers

Multiple circuit control

Multiple switch

200 16D, H01H 926

Patent

active

057214042

ABSTRACT:
A frame component for a notebook computer wherein the frame component has tapered (e.g., conical) depressions that receive protrusions from printed circuit boards mounted adjacent the frame component. The tapered depressions are formed during plastic injection molding of the frame component by a tapered (e.g., conical) protrusion in the interior cavity of the mold. The tapered protrusion in the mold facilitates flow of molten plastic through a region between the apex of the protrusion and an inner surface of the mold which allows for smaller tolerances between the apex of the tapered depression and the bottom surface of the frame component. This results in an overall reduction in the thickness of the frame component from on the order of 3-4 mm to on the order of 1.5 mm. The tolerance between the bottom of the depression configured to receive the protrusion from the printed circuit board is on the order of 0.3-0.4 mm.

REFERENCES:
patent: 4792880 (1988-12-01), Cather et al.
patent: 5438480 (1995-08-01), Yamashita
patent: 5456402 (1995-10-01), Curtin
patent: 5612520 (1997-03-01), Toedtman

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