Thin support for PC board transfer system

Details Thin support for PC board transfer system Thin support for PC board transfer system

1997-09-23

1999-02-16

Keenan, James W.

Material or article handling

Chamber of a type utilized for a heating function and...

Including driven device and/or inclined flow path to carry...

432121, 414157, 414196, 198817, F27B 924

Patent

active

058713255

ABSTRACT:
A transfer system that supports circuit boards as it conveys them through a reflow oven. The system uses a sag support between edge supports. The sag support does not have to move as the circuit board is transferred along the transfer system. The height of the sag support can be easily adjusted. The sag support's mounts can maintain appropriate tension in the sag support even if the sag support expands during operation. The system may use a mechanism to prevent the friction between the boards and the sag support from interfering with the movement of boards along the transfer system.

REFERENCES:
patent: 4754867 (1988-07-01), De Anda
patent: 5267853 (1993-12-01), Arai
patent: 5334014 (1994-08-01), Orbeck et al.
patent: 5511651 (1996-04-01), Barth
patent: 5628605 (1997-05-01), Miyoshi
patent: 5647740 (1997-07-01), Kobaru
patent: 5653586 (1997-08-01), Arai et al.

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