Thin semiconductor device package

Details Thin semiconductor device package Thin semiconductor device package

2009-01-05

2009-12-29

Lee, Calvin (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C438S461000

Reexamination Certificate

active

07638884

ABSTRACT:
A thin semiconductor device package, comprising a thin substrate at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.

REFERENCES:
patent: 6034427 (2000-03-01), Lan et al.
patent: 2002/0014667 (2002-02-01), Shin et al.
patent: 2002/0179564 (2002-12-01), Geobegan et al.
patent: 2003/0145461 (2003-08-01), Kasai et al.
patent: 2006/0055021 (2006-03-01), Yamamoto
patent: 2007/0099336 (2007-05-01), Weston et al.
patent: 2007/0152194 (2007-07-01), Natekar

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