Thin section dispersion strengthened copper body and method of m

Details Thin section dispersion strengthened copper body and method of m Thin section dispersion strengthened copper body and method of m

1988-04-01

1989-12-05

Lechert Jr., Stephen J.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75232, 419 19, C22C 2912

Patent

active

048850292

ABSTRACT:
A thin section fibrous, unrecrystallized dispersion strengthened copper body suitable for use in the manufacture of lead frames for integrated circuits and a method for making same.

REFERENCES:
patent: 4405572 (1984-04-01), Nadkami et al.
patent: 4426598 (1984-01-01), Whitman
patent: 4478787 (1984-10-01), Nadkami et al.
patent: 4707184 (1987-11-01), Hashiguchi et al.
patent: 4752334 (1988-06-01), Nadkami et al.

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