Thin power tape ball grid array package

Details Thin power tape ball grid array package Thin power tape ball grid array package

1997-04-21

1999-02-09

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257712, 257713, 257778, 257738, H01L 2334

Patent

active

058698892

ABSTRACT:
An integrated circuit package includes a heatspreader which is formed to have a centrally disposed recessed portion between planar surfaces, and flex tape extending from the planar surfaces into the centrally disposed surface. A semiconductor chip is mounted on the centrally disposed surface between the flex tape, and wire bonds interconnect bonding pads on the chip to the metal interconnect patterns on the flex tape. Plastic molding or epoxy is then applied to encapsulate the chip and wire bonding in the centrally disposed planar surface of the heat spreader. The package is then readily mounted on a motherboard using solder balls.

REFERENCES:
patent: 5352925 (1994-10-01), Sudoh et al.
patent: 5420460 (1995-05-01), Massingill
"Multi-Layer Tab Tape Having Distinct Signal, Power and Ground Planes, Semiconductor Device Assembly Employing Same, Apparatus for and Method of Assembling Same," U.S. Patent Application Serial No. 08/625,641 filed Mar. 29, 1996.

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