Thin-plate supporting container

Details Thin-plate supporting container Thin-plate supporting container

2008-04-15

2008-04-15

Ackun, Jr., Jacob K. (Department: 3728)

Special receptacle or package

Holder for a removable electrical component

For a semiconductor wafer

C206S454000, C206S832000

Reexamination Certificate

active

07357258

ABSTRACT:
The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

REFERENCES:
patent: 6082540 (2000-07-01), Krampotich et al.
patent: 6267245 (2001-07-01), Bores et al.
patent: 2003/0047476 (2003-03-01), Wu et al.
patent: 2003/0221985 (2003-12-01), Yajima et al.
patent: 2004/0099569 (2004-05-01), Matsutori et al.
patent: 2004/0232036 (2004-11-01), Matsutori et al.
patent: 2005/0006325 (2005-01-01), Hua et al.
patent: 2000-184605 (2000-06-01), None
patent: 2002-122382 (2002-04-01), None

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