Electric heating – Metal heating – By arc
Reexamination Certificate
2011-01-25
2011-01-25
Heinrich, Samuel M (Department: 3742)
Electric heating
Metal heating
By arc
C360S075000, C360S137000
Reexamination Certificate
active
07875831
ABSTRACT:
Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area.
REFERENCES:
patent: 4520254 (1985-05-01), Steiger et al.
patent: 5341256 (1994-08-01), Murata et al.
patent: 5622567 (1997-04-01), Kojima et al.
patent: 5712463 (1998-01-01), Singh et al.
patent: 6011239 (2000-01-01), Singh et al.
patent: 6058132 (2000-05-01), Iso et al.
patent: 6441385 (2002-08-01), Khlif
patent: 6710295 (2004-03-01), Tam et al.
patent: 6711929 (2004-03-01), Yamaguchi et al.
patent: 6984802 (2006-01-01), Kuroiwa et al.
patent: 7213433 (2007-05-01), Ubl et al.
patent: 2002/0108427 (2002-08-01), Matsushita
patent: 2003/0021067 (2003-01-01), Chang et al.
patent: 2003/0154005 (2003-08-01), Wong et al.
patent: 2004/0016733 (2004-01-01), Thaveeprungsriporn
patent: 119661 (1998-11-01), None
patent: 1336664 (2002-02-01), None
patent: 60-231524 (1985-11-01), None
patent: 01-227279 (1989-09-01), None
patent: 05-189906 (1993-07-01), None
patent: 06-114443 (1994-04-01), None
patent: 7-077063 (1995-03-01), None
patent: 10-269538 (1998-10-01), None
patent: 10-277650 (1998-10-01), None
patent: 2000-339894 (2000-12-01), None
Chinese Office Action, Sep. 15, 2006.
Japanese Office Action, Oct. 31, 2006.
Japanese Office Action issued Jan. 20, 2009 in corresponding Japanese Patent Application No. 2002-245887.
Office Action mailed Apr. 30, 2009, issued in U.S. Appl. No. 10/646,818.
Notice of Allowance and Fee(s) Due issued on Oct. 19, 2010, for U.S. Appl. No. 12/318,947.
Inoue Masaru
Kawamata Hiroshi
Tanaka Hironori
Edwards Angell Palmer & & Dodge LLP
Heinrich Samuel M
NHK Spring Co. Ltd.
LandOfFree
Thin plate formation method, thin plate and suspension... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin plate formation method, thin plate and suspension..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin plate formation method, thin plate and suspension... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2676810