Thin multilayered IC memory card

Details Thin multilayered IC memory card Thin multilayered IC memory card

1993-01-11

1995-02-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361744, 361752, 361761, 361810, 257686, 439 69, 439 74, H05K 114

Patent

active

053943007

ABSTRACT:
In an IC memory card, sub-modules, in each of which a plurality of memory ICs are mounted on each of two opposed surfaces of a sub-substrate, are mounted on each of two opposed surfaces of a single substrate. Since the number of substrates connected to a connector is one, soldering of the connector is facilitated, and the structure of the connector can be simplified. Furthermore, in an IC memory card, the sub-modules may be mounted on the substrate in such a manner that they are stacked in two stages at an opening in the substrate. In this way, the thickness of the IC memory card can be minimized. Also, the use of the die bonding process makes connection between the sub-module and the substrate easy.

REFERENCES:
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5191404 (1993-03-01), Wu et al.

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