Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1993-10-18
1998-03-24
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257668, 257678, 361715, 361728, 361735, H01L 2334, H01L 23495, H01L 2302
Patent
active
057316333
ABSTRACT:
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high density contact means provide a greater interconnect capability.
REFERENCES:
patent: 3372310 (1968-03-01), Kantor
patent: 3704455 (1972-11-01), Scarbrough
patent: 3718842 (1973-02-01), Abbott, III et al.
patent: 4342069 (1982-07-01), Link
patent: 4381421 (1983-04-01), Coats et al.
patent: 4656605 (1987-04-01), Clayton
patent: 4672421 (1987-06-01), Lin
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 4727513 (1988-02-01), Clayton
patent: 4850892 (1989-07-01), Clayton et al.
patent: 4972580 (1990-11-01), Nakamura
patent: 4992849 (1991-02-01), Corbert et al.
patent: 4992850 (1991-02-01), Corbert et al.
patent: 5014115 (1991-05-01), Moser
patent: 5014161 (1991-05-01), Lee et al.
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5053853 (1991-10-01), Haj-Ali-Ahmadi et al.
patent: 5065277 (1991-11-01), Davidson
patent: 5109318 (1992-04-01), Funari et al.
patent: 5119269 (1992-06-01), Nakayama
patent: 5140405 (1992-08-01), King et al.
patent: 5173840 (1992-12-01), Kodai et al.
patent: 5208729 (1993-05-01), Cipolla et al.
patent: 5224023 (1993-06-01), Smith et al.
patent: 5229641 (1993-07-01), Katayama
patent: 5229917 (1993-07-01), Harris et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
INSPEC, Electronic Design, vol. 24, No. 1, p.120, 5 Jan. 76, "Expand a System's Memory Capacity w/o Mounting Hardware and Board Space";Fisher.
Arroyo T. M.
Crane Sara W.
Hamilton Gary W.
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