Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1994-07-11
1997-08-26
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257668, 257701, 257704, 257712, 257723, 257729, 257773, 257787, 361728, H01L 2302, H01L 23495, H01L 2312, H01L 2334
Patent
active
056613393
ABSTRACT:
An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the composite semiconductor substrate sub-assembly includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the composite semiconductor substrate subassembly, comprising a cover plate with the composite substrate attached thereto, is attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. The composite substrate employed in the present invention offers the advantage of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame.
REFERENCES:
patent: 3372310 (1968-03-01), Kantor
patent: 3704455 (1972-11-01), Scarbrough
patent: 4169642 (1979-10-01), Mouissies
patent: 4342069 (1982-07-01), Link
patent: 4656605 (1987-04-01), Clayton
patent: 4672421 (1987-06-01), Lin
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 4727513 (1988-02-01), Clayton
patent: 4850892 (1989-07-01), Clayton et al.
patent: 4992849 (1991-02-01), Corbert et al.
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5014115 (1991-05-01), Moser
patent: 5014161 (1991-05-01), Lef et al.
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5053853 (1991-10-01), Haj-Ali-Ahmadi et al.
patent: 5109318 (1992-04-01), Funari et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5224023 (1993-06-01), Smith et al.
patent: 5400003 (1995-03-01), Kledzik
INSPEC, Electronic Design, vol. 24, No. 1, p. 120 5 Jan. 76 Expand a System's Memory Capacity w/o Mounting Hardware and BD Space.
Arroyo T. M.
Saadat Mahshid
LandOfFree
Thin multichip module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin multichip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin multichip module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1990259