Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1995-06-07
1998-01-13
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257712, 361720, 361785, 439629, 439638, H01L 2334
Patent
active
057082979
ABSTRACT:
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components. In some of the embodiments disclosed herein, the subassembly(s), comprising a cover plate with the composite substrate attached thereto, is permanently attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material. In other embodiments, the subassembly(s) are removably attached to a module frame socket. The composite substrate employed in the present invention offers the advantages of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame, and aids in the transfer of heat away from the semiconductor devices operating thereon. The module frame provides a protective enclosure for the multichip semiconductor devices and can be molded for compatible mating with existing SIMM sockets. Other high density contact means provide a greater interconnect capability.
REFERENCES:
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 5119269 (1992-06-01), Nakayama
patent: 5224023 (1993-06-01), Smith et al.
patent: 5268815 (1993-12-01), Cipolla et al.
Arroyo T. M.
Saadat Mahshid D.
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