Thin multichip flex-module

Details Thin multichip flex-module Thin multichip flex-module

2008-07-01

2008-07-01

Gushi, Ross N (Department: 2833)

Electrical connectors

Having retainer or passageway for fluent material

Liquid material to dissipate, remove, or block the flow of heat

Reexamination Certificate

active

11715141

ABSTRACT:
A socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, at least two fluid connections configured to matably engage corresponding fluid connections on the in-line module, whereby fluid may be circulated into and out of the module while maintaining electrical continuity between the pins and the contacts. Alternatively, a socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, a fluid connection configured to matably engage a corresponding fluid connection on the in-line module, whereby fluid may be introduced into the module through the socket and vented elsewhere while maintaining electrical continuity between the pins and the contacts.

REFERENCES:
patent: 4656605 (1987-04-01), Clayton
patent: 4727513 (1988-02-01), Clayton
patent: 4850892 (1989-07-01), Clayton
patent: 5224023 (1993-06-01), Smith et al.
patent: 5661339 (1997-08-01), Clayton
patent: 5708297 (1998-01-01), Clayton
patent: 5731633 (1998-03-01), Clayton
patent: 5751553 (1998-05-01), Clayton
patent: 5908333 (1999-06-01), Perino et al.
patent: 6025992 (2000-02-01), Dodge et al.
patent: 6049975 (2000-04-01), Clayton
patent: 6091145 (2000-07-01), Clayton
patent: 6232659 (2001-05-01), Clayton
patent: 6273759 (2001-08-01), Perino et al.
patent: 6353538 (2002-03-01), Ali et al.
patent: 6362966 (2002-03-01), Ali et al.
patent: 6472744 (2002-10-01), Sato et al.
patent: 6665190 (2003-12-01), Clayton
patent: 6670697 (2003-12-01), Hasegawa
patent: 6674644 (2004-01-01), Schulz
patent: 6762942 (2004-07-01), Smith
patent: 6840808 (2005-01-01), Ruckerbauer et al.
patent: 6896534 (2005-05-01), Ruckerbauer
patent: RE39153 (2006-07-01), Perino et al.
patent: 7122889 (2006-10-01), Belgacem
patent: 7215551 (2007-05-01), Wang et al.
patent: 7289327 (2007-10-01), Goodwin et al.
patent: 2002/0142660 (2002-10-01), Abe
patent: 2004/0048518 (2004-03-01), Ruckerbauer et al.
patent: 2006/0048385 (2006-03-01), Cady et al.
patent: 2006/0049500 (2006-03-01), Goodwin
patent: 2006/0049502 (2006-03-01), Goodwin et al.
patent: 2006/0049512 (2006-03-01), Goodwin
patent: 2006/0049513 (2006-03-01), Goodwin
patent: 2006/0050488 (2006-03-01), Goodwin
patent: 2006/0050489 (2006-03-01), Wehrly et al.
patent: 2006/0050492 (2006-03-01), Goodwin et al.
patent: 2006/0050496 (2006-03-01), Goodwin
patent: 2006/0050497 (2006-03-01), Goodwin
patent: 2006/0050498 (2006-03-01), Cady et al.
patent: 2006/0050592 (2006-03-01), Cady et al.
patent: 2006/0053345 (2006-03-01), Goodwin
patent: 2006/0055024 (2006-03-01), Wehrly
patent: 2006/0091529 (2006-05-01), Wehrly et al.
patent: 2006/0125067 (2006-06-01), Wehrly et al.
patent: 2006/0129888 (2006-06-01), Szewerenko et al.
patent: 2006/0198238 (2006-09-01), Partridge et al.
patent: 2006/0203442 (2006-09-01), Goodwin
patent: 2006/0250780 (2006-11-01), Goodwin
patent: 2006/0261449 (2006-11-01), Rapport et al.
patent: 2007/0111606 (2007-05-01), Goodwin
patent: 2007/0115017 (2007-05-01), Goodwin et al.
patent: 2007/0126124 (2007-06-01), Rapport et al.
patent: 2007/0126125 (2007-06-01), Rapport et al.
patent: 2007/0176286 (2007-08-01), Wehrly, Jr.
patent: 2007/0201208 (2007-08-01), Goodwin et al.
patent: 2007/0211426 (2007-09-01), Clayton et al.
patent: 2007/0211711 (2007-09-01), Clayton
patent: 2007/0212902 (2007-09-01), Clayton et al.
patent: 2007/0212906 (2007-09-01), Clayton et al.
patent: 2007/0212919 (2007-09-01), Clayton et al.
patent: 2007/0212920 (2007-09-01), Clayton et al.
patent: 2007/0258217 (2007-11-01), Roper et al.
patent: 2008/0030966 (2008-02-01), Goodwin
patent: 2008/0030972 (2008-02-01), Goodwin
patent: 3424929 (1996-02-01), None
ANON. Thermal Performance of ArctiCore(tm) FBDIMMs and Conventional FBDIMMs, Staktek Corp. Technology Whitepaper.

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